Title:
焼成装置
Document Type and Number:
Japanese Patent JP6745588
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a burning device capable of suppressing warpage deformation of a laminate.SOLUTION: A device 100 according to the present invention comprises: a chamber 10 in which a laminate 50 is arranged; a pair of heaters 20, 22 heating the laminate 50 from both lamination-directional sides respectively; an imaging part 30 imaging the laminate 50 from outside the chamber 10; and a control part 40. The control part 40 determines whether the laminate 50 warps to deform by analyzing an image of the laminate 50, imaged by the imaging part 30, in a process of heat treatment. When it is determined that the laminate 50 warps to deform, the control part is configured to perform control to raise a heating temperature of a heater, arranged on a convex surface side of the laminate 50 having warped to deform, between the pair of heaters 20, 22 and/or control to lower a heating temperature of a heater arranged on a concave surface side so that the warpage deformation becomes smaller.SELECTED DRAWING: Figure 1
Inventors:
Yosuke Takahashi
Application Number:
JP2015121026A
Publication Date:
August 26, 2020
Filing Date:
June 16, 2015
Export Citation:
Assignee:
Noritake Company Limited
International Classes:
F27B17/00; F27D19/00; F27D21/00
Domestic Patent References:
| JP64024075A | ||||
| JP64024076A | ||||
| JP2004042512A | ||||
| JP2013197284A | ||||
| JP6077655A | ||||
| JP2006120721A | ||||
| JP2006228820A | ||||
| JP2006351871A |
Foreign References:
| US6561796 |
Attorney, Agent or Firm:
Makoto Abe
Shunsuke Fukutomi
Shunsuke Fukutomi