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Patent Searching and Data


Title:
BALANCE ADJUSTING METHOD
Document Type and Number:
Japanese Patent JPH04136544
Kind Code:
A
Abstract:

PURPOSE: To quickly perform balance adjustment of a high-speed rotary body by welding a solder onto the copper-foil part or the solderplated part of a disc base plate attached to the rotary body to adjust a balance.

CONSTITUTION: When balance adjustment is performed with a base plate 2 fixed to a disc 1, a reference point (a) is provided on the disc 1 so that the phase of an unbalanced position outputted from a balance testing machine can be set with respect to the point. When the disc 1 is rotated on the balance testing machine, the unbalanced position and quantity are displayed. After the unbalanced position is found out on the disc 1 in consideration of the reference point (a) and the direction of rotation, a solder 4 is welded onto a copper foil 3 of the base plate 2 at the unbalanced position. Since the solder 4 hardens as the temperature decreases as is generally known, the solder does not scatter by centrifugal force even when the disc is rotated at high speeds immediately after soldering, and thus balance adjustment can be quickly performed.


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Inventors:
KAJI HIROYUKI
ARIYAMA NAKAZOU
TAKAHASHI AKIYOSHI
MIURA AKIYUKI
HOSHI TATSUYA
Application Number:
JP25534790A
Publication Date:
May 11, 1992
Filing Date:
September 27, 1990
Export Citation:
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Assignee:
COPAL ELECTRONICS
International Classes:
F16F15/32; F16F15/34; (IPC1-7): F16F15/34
Domestic Patent References:
JPS6023649A1985-02-06