Title:
ボールアタッチ装置及びこれを用いるソルダボールアタッチ方法
Document Type and Number:
Japanese Patent JP4963267
Kind Code:
B2
Abstract:
A ball attaching apparatus for respectively attaching solder balls onto a plurality of ball lands of a material which has mold caps formed between the ball lands. The apparatus includes an indexer on which the material is seated and fixed; a holder located above the indexer such that it can be raised and lowered; an attachment plate installed on a lower surface of the holder, having projections at positions corresponding to the mold caps of the material, and defined with grooves at positions corresponding to the ball lands of the material, in which the solder balls are placed; and eject pins arranged in the respective grooves of the attachment plate for conveying and dropping the solder balls through introduction and removal of vacuum.
Inventors:
Luhai Pearl
Gold
Good friend
Takaso
Kin Tai
Gold
Good friend
Takaso
Kin Tai
Application Number:
JP2007137078A
Publication Date:
June 27, 2012
Filing Date:
May 23, 2007
Export Citation:
Assignee:
Hynix Semiconductor Inc.
International Classes:
H01L21/60; B23K3/06; H01L23/12; H05K3/34
Domestic Patent References:
| JP11186329A | ||||
| JP2006175471A | ||||
| JP9298356A | ||||
| JP10056102A | ||||
| JP9232375A |
Attorney, Agent or Firm:
Kunio Ueda
Noriharu Fujita
Kawakami Miki
Noriharu Fujita
Kawakami Miki