Title:
BALL BOND PRESSURE-BONDING METHOD OF METALLIC SMALL-GAGE WIRE
Document Type and Number:
Japanese Patent JPS6014447
Kind Code:
A
Abstract:
PURPOSE:To eliminate the need for adjusting the position of laser beams, and to simplify and facilitate work by blowing out a small-gage wire by laser beams projecting from an optical fiber fixed to the side surface of a capillary chip and forming a ball. CONSTITUTION:One or two or more of optical fibers 4 are mounted to the side surface of a capillary chip 3 with a conical side surface, fine condenser lenses 5 are set at the tips of the optical fibers 4, and the focuses are adjusted so that laser beams are condensed to a section A to be blown out of a small-gage wire 2. The capillary chip 3 holding the small-gage wire 2 is arranged to the upper section of a substrate 1, laser beams are projected to the section A of the small- gage wire 2 to blow out the small-gage wire, and a ball 6 is formed. Laser beams are extended under the state in which they are left as they are, and projected to the bonding section of the substrate 1 to heat it. The position of the projection of laser beams need not be readjusted. The ball 6 is pressure-bonded with the substrate 1 by the chip 3 or ultrasonic waves are applied simultaneously to weld the ball to the substrate, and the small-gage wire 2 is bonded with the substrate 1.
Inventors:
ASHIDA NORIYUKI
SATOU KENICHI
SATOU KENICHI
Application Number:
JP12289583A
Publication Date:
January 25, 1985
Filing Date:
July 05, 1983
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
B23K20/00; H01L21/60; H01L21/603; (IPC1-7): H01L21/60; B23K20/10
Attorney, Agent or Firm:
Hidemi Aoki