Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
BALL JOINT
Document Type and Number:
Japanese Patent JP2014088902
Kind Code:
A
Abstract:

To provide a ball joint capable of ensuring conductivity between a ball stud and a knuckle without affecting slidability.

A stud part 22 of a ball stud 15 and a conductive arm 16 are directly connected with a conductive member 19 to electrically connect the arm 16 and a conductive knuckle 13. The ball joint can be constituted not to apply electrical current to sliding parts such as a ball 21 slidably housed in a housing 31 of the arm 16, and conductivity can be ensured without affecting slidability.


Inventors:
SATO YASUHIRO
FUJIWARA YOSUKE
Application Number:
JP2012238836A
Publication Date:
May 15, 2014
Filing Date:
October 30, 2012
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SOMIC ISHIKAWA INC
International Classes:
F16C11/06
Domestic Patent References:
JPS59103922U1984-07-12
JP2003525404A2003-08-26
JP2011158057A2011-08-18
JPH03144108A1991-06-19
JP2003525404A2003-08-26
JPS59103922U1984-07-12
Foreign References:
US20040057779A12004-03-25
Attorney, Agent or Firm:
樺澤 襄
Satoshi Kabazawa
Tetsuya Yamada



 
Previous Patent: COLUMN STRUCTURE

Next Patent: TORQUE CONVERTER STRUCTURE