Title:
BAND MATERIAL ADHERING DEVICE AND BAND MATERIAL REMOVING DEVICE
Document Type and Number:
Japanese Patent JP2003226305
Kind Code:
A
Abstract:
To adhere a band material without burning workers.
This band material adhering and removing device is provided with a band material K to be wound around a laminated sheet paper P with its both ends superimposed, and a heating part 6 for heating and adhering the superimposed part Ka of the material K by pressing a heating block 10 thereon, and a cover material 7 for covering the peripheral part of the block 10.
Inventors:
Saito, Mitsuhiro
Itotani, Masakazu
Itotani, Masakazu
Application Number:
JP2002000024302
Publication Date:
August 12, 2003
Filing Date:
January 31, 2002
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
B65B13/32; B65B27/08; B65B69/00; B65B13/18; B65B27/08; B65B69/00; (IPC1-7): B65B13/32; B65B27/08; B65B69/00
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