BAND MATERIAL FOR PACKAGING SMALL COMPONENT, METHOD AND DEVICE FOR PACKAGING, AND METHOD FOR MOUNTING ELECTRONIC COMPONENT

Title:

BAND MATERIAL FOR PACKAGING SMALL COMPONENT, METHOD AND DEVICE FOR PACKAGING, AND METHOD FOR MOUNTING ELECTRONIC COMPONENT

Document Type and Number:

Japanese Patent JP11091711

Kind Code:

A

Inventors:

ASAO YUKIHIKO
ICHITENMANYA EIJI
MORI KAZUHIRO
TANAKA KURAHEI
TOMII UZOU
UOZU YOZO

Application Number:

JP14018198A

Publication Date:

April 06, 1999

Filing Date:

May 21, 1998

Export Citation:

Assignee:

MATSUSHITA ELECTRIC IND CO LTD
NISSHO KK

International Classes:

B65B15/04; B65D73/02; B65D85/86; B65B15/00; (IPC1-7): B65B15/04; B65D73/02

Attorney, Agent or Firm:

Takehiko Matsumoto

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