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Title:
紙幣処理機
Document Type and Number:
Japanese Patent JP4907147
Kind Code:
B2
Abstract:

To provide a bill handling apparatus for creating a wrapped stack of bills by stacking a predetermined number of bills to create the stack of bills, and then winding a binding tape around the created stack of bills including the predetermined number of bills, the apparatus being capable of creating stacks of bills that can be managed as desired.

The bill handling apparatus includes a bill stacking part 20 for stacking a predetermined number of bills; a wrapping process part 31 for creating a stack of bills by winding around the predetermined number of bills stacked by the bill stacking part a binding tape T formed with an inlet having an IC chip and an antenna built in, and wrapping the stack; an RFID reader 10b for reading RFID data written on the bills; and an RFID writer 35 for writing the RFID data on the IC chip in the inlet of the binding tape.

COPYRIGHT: (C)2007,JPO&INPIT


Inventors:
Masahiro Takahashi
Application Number:
JP2005309318A
Publication Date:
March 28, 2012
Filing Date:
October 25, 2005
Export Citation:
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Assignee:
Laurel Seiki Co., Ltd.
International Classes:
G07D1/00; G07D3/00
Domestic Patent References:
JP2002157629A
JP2003175254A
JP2002169968A
JP2004164156A
JP2002163612A
JP2002197509A
Attorney, Agent or Firm:
Koichi Oishi
Mitsuhiro Washito