Title:
BARREL PLATING APPARATUS
Document Type and Number:
Japanese Patent JP3431007
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a barrel plating apparatus which reduces and prevents the unbalance and stagnation of a flow of a work to be plated in a barrel, suppress generation of a defect, and reliably form the plating film with the uniform thickness on the work.
SOLUTION: A conical fitting member 4 is fitted to a cathode introduction portion 2 in the barrel which is installed on an end face 1a a position almost near the rotation axis A of the barrel 1 and held to the barrel 1 so as to rotate, so that the axis is substantially concentric with the rotation axis A of the barrel 1. The top T is directed to the center side of the barrel 1, a bottom side circumferential portion F on the opposite side to the top T is brought close to the end face (the inner side) 1a of the barrel 1, and the work 8 to be plated does not pass a space between the portion F and the end face 1a of the barrel 1.
Inventors:
Yukio Sanada
Kenichi Hayashi
Kenichi Hayashi
Application Number:
JP2000093878A
Publication Date:
July 28, 2003
Filing Date:
March 30, 2000
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
C25D17/20; (IPC1-7): C25D17/20
Domestic Patent References:
| JP9119000A |
Attorney, Agent or Firm:
Hitoshi Nishizawa
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