Title:
BARRIER POLISHING FLUID
Document Type and Number:
Japanese Patent JP2005136388
Kind Code:
A
Abstract:
To provide a barrier-removing composition which removes a barrier at a high rate while reducing dishing of metal wiring and erosion of insulators.
This polishing fluid is useful for polishing a tantalum-containing barrier material of a semiconductor substrate. The polishing fluid includes a nitrogen-containing compound which has at least two nitrogen atoms and comprises an imine compound and a hydrazine compound. The nitrogen-containing compound is free of electron-withdrawing substituents. The polishing fluid is capable of removing the tantalum-containing barrier material from a surface of the semiconductor substrate without an abrasive grain.
Inventors:
BIAN JINRU
Application Number:
JP2004279441A
Publication Date:
May 26, 2005
Filing Date:
September 27, 2004
Export Citation:
Assignee:
ROHM & HAAS ELECT MAT
International Classes:
B24B37/00; C09G1/02; C09K3/14; H01L21/304; H01L21/321; (IPC1-7): H01L21/304; B24B37/00; C09K3/14
Domestic Patent References:
| JP2001085375A | 2001-03-30 | |||
| JP2003068683A | 2003-03-07 | |||
| JP2001144044A | 2001-05-25 | |||
| JP2003507895A | 2003-02-25 | |||
| JP2001085375A | 2001-03-30 | |||
| JP2003068683A | 2003-03-07 | |||
| JP2001144044A | 2001-05-25 | |||
| JP2003507895A | 2003-02-25 |
Foreign References:
| US20030131535A1 | 2003-07-17 | |||
| WO2002056351A2 | 2002-07-18 | |||
| US20030131535A1 | 2003-07-17 | |||
| WO2002056351A2 | 2002-07-18 |
Attorney, Agent or Firm:
Hajime Tsukuni
Fumio Shinoda
Koshiro Tsukuda
Fumio Shinoda
Koshiro Tsukuda