Title:
半導体製造工程用基材フィルム及び該基材フィルムを用いたダイシング用粘着フィルム
Document Type and Number:
Japanese Patent JP7222679
Kind Code:
B2
Abstract:
To provide a film which is excellent in film-forming property, has excellent antistatic performance and is also excellent in mechanical properties such as flexibility and heat-resistant stability.SOLUTION: There is provided a base film for a semiconductor manufacturing process which has at least one resin layer composed of a resin composition comprising 25 to 40 mass% of a homopolypropylene, 21 to 39 mass% of a polymer-type antistatic agent and 21 to 54 mass% of a thermoplastic elastomer (the total amount of the homopolypropylene, the polymer-type antistatic agent and the thermoplastic elastomer in the resin composition is defined as 100 mass%).
More Like This:
Inventors:
Tomoya Nagasawa
Yuji Kawaguchi
Yuji Kawaguchi
Application Number:
JP2018225268A
Publication Date:
February 15, 2023
Filing Date:
November 30, 2018
Export Citation:
Assignee:
Diamond Plus Film Co., Ltd.
International Classes:
C08J5/18; C08L23/12; C08L53/00; C08L71/02; C09J7/29; H01L21/301
Domestic Patent References:
| JP2012069999A | ||||
| JP2008153431A | ||||
| JP2008147341A | ||||
| JP2016210898A |
Attorney, Agent or Firm:
Makoto Ono
Kanayama Sage
Yoshiyuki Tsubokura
Kazuki Shigemori
Kenji Ando
Hidehiko Ichikawa
Takahiro Aoki
Yoshie Sakurada
Yosuke Kawasaki
Takuya Gomibuchi
Toshikazu Imato
Youichi Iino
Yusuke Ichikawa
Masahiro Moriyama
Yoshikazu Iwase
Yasufumi Shiroyama
Kanayama Sage
Yoshiyuki Tsubokura
Kazuki Shigemori
Kenji Ando
Hidehiko Ichikawa
Takahiro Aoki
Yoshie Sakurada
Yosuke Kawasaki
Takuya Gomibuchi
Toshikazu Imato
Youichi Iino
Yusuke Ichikawa
Masahiro Moriyama
Yoshikazu Iwase
Yasufumi Shiroyama