Title:
半導体製造工程用粘着フィルムに使用する基材フィルム
Document Type and Number:
Japanese Patent JP6635874
Kind Code:
B2
More Like This:
| WO/2017/183310 | ADHESIVE-FILM-INTEGRATED PRESSURE-SENSITIVE ADHESIVE TAPE AND PROCESS FOR PRODUCING SEMICONDUCTOR CHIP |
| JP2006210631 | SEMICONDUCTOR DEVICE |
| JP2016076520 | WAFER PROCESSING METHOD |
Inventors:
Yoshifumi Yagi
Watanabe registration
Watanabe registration
Application Number:
JP2016106595A
Publication Date:
January 29, 2020
Filing Date:
May 27, 2016
Export Citation:
Assignee:
Diamond Plus Film Co., Ltd.
International Classes:
H01L21/301; B32B27/00; B32B27/30; B32B27/36; C09J201/00
Domestic Patent References:
| JP2015187245A | ||||
| JP2014152254A |
Attorney, Agent or Firm:
Makoto Ono
Kenkyo Kanayama
Mitsuaki Tsubokura
Kazuki Shigemori
Kenji Ando
Hidehiko Ichikawa
Takahiro Aoki
Yoshie Sakurada
Yousuke Kawasaki
Toshikazu Imato
Yoshikazu Iwase
Yasufumi Shiroyama
Kenkyo Kanayama
Mitsuaki Tsubokura
Kazuki Shigemori
Kenji Ando
Hidehiko Ichikawa
Takahiro Aoki
Yoshie Sakurada
Yousuke Kawasaki
Toshikazu Imato
Yoshikazu Iwase
Yasufumi Shiroyama