Title:
耐熱性電子機器用基材
Document Type and Number:
Japanese Patent JP7329952
Kind Code:
B2
Abstract:
The present disclosure proposes an improved heat resistant base for electronic equipment having transparency, heat resistance and mechanical strength and also having superior optical properties and quality, and thereby capable of replacing a transparent glass base.The present disclosure is accomplished by the heat resistant base for electronic equipment including a polyimide-based resin and a hollow particle, wherein a plurality of the hollow particles are dispersed and present in the polyimide-based resin, and the hollow particle has an average particle diameter of greater than or equal to 10 nm and less than or equal to 300 nm.
Inventors:
Shinji Shiraki
Young Sun Park
Young Sun Park
Application Number:
JP2019070515A
Publication Date:
August 21, 2023
Filing Date:
April 02, 2019
Export Citation:
Assignee:
LG HAUSYS,LTD.
International Classes:
C08L79/08; C08G73/10; C08J5/18; C08K7/22; G02B5/30; H01L21/336; H01L29/786
Domestic Patent References:
| JP2010087097A | ||||
| JP2015530700A | ||||
| JP2007056158A | ||||
| JP2018502931A | ||||
| JP2012057003A |
Attorney, Agent or Firm:
Takeshi Katada
Tomohiro Matsuno
Tomohiro Matsuno