Title:
基材粒子、導電性粒子、導電材料、接続材料及び接続構造体
Document Type and Number:
Japanese Patent JP7453738
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate particle suppressing scratch of an adherend, capable of controlling gaps at high accuracy, and capable of preferably contacting particles using the substrate particles to the adherend for various adherends.SOLUTION: The substrate particle is a polymer of a polymerizable compound and has compressive elasticity modulus with 10% compression is 2500 N/mmto 4000 N/mm, compressive elasticity modulus with 30% compression is 1000 N/mmto 2000 N/mmand a ratio of compressive elasticity modulus with 10% compression to compressive elasticity modulus with 30% compression is 2.0 or more.SELECTED DRAWING: Figure 1
Inventors:
Yasuyuki Yamada
Saori Ueda
Saori Ueda
Application Number:
JP2017210921A
Publication Date:
March 21, 2024
Filing Date:
October 31, 2017
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
C08J3/12; C08F257/02; C08F265/06; C09J9/02; C09J201/00; H01B1/00; H01B1/22; H01B5/00; H01B5/16; H01R11/01
Domestic Patent References:
| JP201194146A | ||||
| JP2014239052A | ||||
| JP201355046A | ||||
| JP201615256A | ||||
| JP201481928A | ||||
| JP9171184A | ||||
| JP347804A |
Foreign References:
| WO2014007334A1 | ||||
| WO2012020799A1 |
Attorney, Agent or Firm:
Patent Attorney Osaka Front Patent Office