Title:
基材処理装置
Document Type and Number:
Japanese Patent JP6747328
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate processing device which can uniformly process a surface of a substrate having a bending part in at least a part thereof.SOLUTION: A substrate processing device includes: a substrate support part 23a which supports a substrate (a bending glass plate 35) having a bending part in at least a part thereof; a processing head 15 in which a tool 17 and a motor for rotationally driving the tool 17 are mounted; a process liquid supply part; a multi-axis robot 13 in which the processing head 15 is attached to a tip part of a multi-joint arm; and a controller 20. The controller 20 moves the processing head 15 along a surface of the substrate while holding an inclination angle of the tool 17 relative to a normal direction of a processed surface of the substrate.SELECTED DRAWING: Figure 1
Inventors:
Ono Takeaki
Masanobu Ezawa
Moriki Yuki
Hirotaka Nakamura
Masanobu Ezawa
Moriki Yuki
Hirotaka Nakamura
Application Number:
JP2017023415A
Publication Date:
August 26, 2020
Filing Date:
February 10, 2017
Export Citation:
Assignee:
AGC Inc.
International Classes:
B24B27/00; B24B19/26; B24B41/06; B25J13/00
Domestic Patent References:
| JP2013112554A | ||||
| JP2015511542A | ||||
| JP10249697A | ||||
| JP2016111264A | ||||
| JP4046755A | ||||
| JP2256457A | ||||
| JP9183627A | ||||
| JP2015120226A |
Foreign References:
| WO2016199612A1 | ||||
| US20140113525 |
Attorney, Agent or Firm:
Patent business corporation glory patent office