To provide a base material for thermal adhesion having excellent properties in both flame retardance and adhesion, which is excellent in flexibility and shape-forming property to a mold, which has excellent adhesion and capable of being strongly integrated with various materials of a different kind, and which is capable of giving excellent flame retardance.

The base material for thermal adhesion is a composite material obtained by contacting and integrating a substrate comprising a thermoplastic resin (a) and a filament aggregate comprising a thermoplastic resin (b), in which, when a limiting oxygen index of the thermoplastic resin (a) is referred to as La and a limiting oxygen index of the thermoplastic resin (b) is referred to as Lb, Lb is ≥25 and Lb>La are satisfied, and, when the thermoplastic resin (a) has the melting point, the melting point is referred to as Ta, and when the thermoplastic resin does not have the melting point, a glass transition temperature is referred to as Ta, when the thermoplastic resin (b) has the melting point, the melting point is referred to as Tb, and when the thermoplastic resin (b) does not have the melting point, a glass transition temperature is referred to as Tb, Tb>Ta is satisfied.

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