Title:
アルミニウム−炭化珪素質複合体及びパワーモジュール用ベース板
Document Type and Number:
Japanese Patent JP6704847
Kind Code:
B2
Abstract:
[Problem] To provide an aluminum-silicon carbide composite which is suitable for use as a power-module base plate. [Solution] An aluminum-silicon carbide composite wherein a peripheral portion having, as a main component thereof, an aluminum-ceramic fiber composite containing ceramic fibers having an average fiber diameter of at most 20 µm and an average aspect ratio of at least 100, is provided on the periphery of a flat plate-shaped aluminum-silicon carbide composite having a plate thickness of 2 to 6 mm formed by impregnating, with a metal containing aluminum, a porous silicon carbide molded body having a silicon carbide content of 50 to 80 vol%, and wherein the proportion of the aluminum-ceramic fiber composite occupied in the peripheral portion is at least 50 area%.
Inventors:
Daisuke Goto
Hideki Hirotsuru
Yoshitaka Taniguchi
Iwamoto Go
Kazunori Koyanagi
Hideki Hirotsuru
Yoshitaka Taniguchi
Iwamoto Go
Kazunori Koyanagi
Application Number:
JP2016508767A
Publication Date:
June 03, 2020
Filing Date:
March 18, 2015
Export Citation:
Assignee:
Denka Co., Ltd.
International Classes:
H01L23/36; B22D18/02; B22D19/00; B22D19/14; C04B41/88; H01L23/373
Domestic Patent References:
| JP11277217A |
Foreign References:
| WO2007080701A1 | ||||
| WO2007125878A1 |
Attorney, Agent or Firm:
Sonoda/Kobayashi Patent Business Corporation