BASE SEMICONDUCTOR CHIP, SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND ITS MANUFACTURE

Title:

BASE SEMICONDUCTOR CHIP, SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND ITS MANUFACTURE

Document Type and Number:

Japanese Patent JP2007227883

Kind Code:

A

Abstract:

To provide a semiconductor integrated circuit device in which arrangement of each function block in a semiconductor substrate can be easily verified, the function blocks can be selectively combined and divided, and further free recombination of connection of the function blocks is enabled.

The semiconductor integrated circuit device comprises: a base semiconductor chip 20 comprising a plurality of function blocks 21 which are separately formed in a specified region in the semiconductor substrate and have pads 22, respectively, for inputting/outputting a signal; and a plurality of wirings 31 which are connected to the pads 22 while disconnection is allowed. Input/output of the signal between the function blocks 21 is carried out with each wiring 31.

Inventors:

ISHIYAMA YASUHIRO

Application Number:

JP2006308793A

Publication Date:

September 06, 2007

Filing Date:

November 15, 2006

Export Citation:

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Assignee:

MATSUSHITA ELECTRIC IND CO LTD

International Classes:

H01L21/822; H01L21/82; H01L23/52; H01L25/04; H01L25/18; H01L27/04

Attorney, Agent or Firm:

Hiroshi Maeda
Hiroshi Takeuchi
Takahisa Shimada
Yuji Takeuchi
Katsumi Imae
Atsushi Fujita
Kazunari Ninomiya
Tomoo Harada
Iseki Katsumori
Seki Kei
Yasuya Sugiura

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