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Title:
BATCH TYPE HEAT TREATMENT EQUIPMENT AND ITS CONTROL METHOD
Document Type and Number:
Japanese Patent JP3497450
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide batch type heat treatment equipment which can appropriately cope with multi-kind small-scale production.
SOLUTION: A reaction chamber 2 is provided with a plurality of heaters 31-35 and a plurality of temperature sensors, and accommodates a wafer boat 23. A control section 100 estimates (calculates) the temperatures of wafers W placed on the wafer boat 23 in the chamber 2 in accordance with the number and arranged positions of the wafers W, and stores many mathematical models for finding outputs used for setting estimated temperatures to expected values and target temperature loci. When the wafer boat 23 is loaded in the reaction chamber 2, the control section 100 reads out the mathematical model and target temperature locus corresponding to the number and arranged positions of the wafers W placed on the board 23. When film formation is started, the section 100 estimates the temperatures of the wafers W in the chamber 2 by using the outputs of the temperature sensors S and the model, and separately controls the electric power supplied to the heaters 31-35 so that the estimated temperatures may be constringed to the target temperature locus.


Inventors:
Fujio Suzuki
Wang Wenling
Koichi Sakamoto
Yasuhara Moyu
Pradeep Pandy
Sunil Shah
Application Number:
JP2000204592A
Publication Date:
February 16, 2004
Filing Date:
July 06, 2000
Export Citation:
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Assignee:
東京エレクトロン株式会社
International Classes:
C23C14/50; C23C16/46; F27B5/18; F27D19/00; H01L21/00; H01L21/205; H01L21/22; H01L21/31; H01L21/316; (IPC1-7): H01L21/31; H01L21/22
Domestic Patent References:
JP10189465A
JP2000195809A
JP2001144019A
Attorney, Agent or Firm:
Mitsuru Kimura