Title:
バッチ式熱処理装置及びその制御方法
Document Type and Number:
Japanese Patent JP4493192
Kind Code:
B2
Abstract:
A reaction tube 2 comprises heaters 31 - 35, and temperature sensors Sin1 - Sin5, Sout1 - Sout5, and receives a wafer boat 23. A controller 100 estimates temperatures of wafers W and temperatures of the temperature sensors Sin1 - Sin5 in 5 zones in the reaction tube 2 corresponding to the heaters 31 - 35 by using the temperature sensors Sin1 - Sin5, Sout1 - Sout5 and electric powers of the heaters 31 - 35. Based on relationships between estimated temperatures of the temperature sensors Sin1 - Sin5 and really metered temperatures, functions f1 - f5 expressing the relationships between the estimated temperatures and the really metered temperatures are given for the respective zones. The functions f1 - f5 are substituted by the estimated wafer temperatures to correct the estimated wafer temperatures. Electric powers to be fed to the respective heaters 31 - 35 are respectively controlled so that the corrected wafer temperatures are converged to target temperature trajectories.
Inventors:
Wang Wenling
Koichi Sakamoto
Suzuki Fujio
Yasuhara Moyu
Pradeep Pandy
Sunil Shah
Mark Ericsson
Koichi Sakamoto
Suzuki Fujio
Yasuhara Moyu
Pradeep Pandy
Sunil Shah
Mark Ericsson
Application Number:
JP2000278526A
Publication Date:
June 30, 2010
Filing Date:
September 13, 2000
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
G05D23/19; H01L21/324; C23C16/46; C23C16/52; C30B31/18; F27B5/18; F27D19/00; F27D21/00; H01L21/00; H01L21/205; H01L21/22
Domestic Patent References:
| JP7283158A | ||||
| JP3145121A | ||||
| JP9133588A | ||||
| JP7294569A | ||||
| JP3057799A |
Attorney, Agent or Firm:
Kimura Mitsuru