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Title:
BEAM FACING PLATE FOR SEMICONDUCTOR MANUFACTURING DEVICE AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JPH0950969
Kind Code:
A
Abstract:

To suppress the temperature rise by a thermal load at the surface of a carbon protective plate which is formed as a beam facing surface as a countermeasure against erosion by joining a metallic heat sink to the rear surface of the protective plate.

It is preferable to use a metallurgical method at the time of joining 2 a metallic heat sink 3 to the rear surface of the carbon protective plate (carbon plate) 1 which is formed as a beam facing surface. It is also preferable to use brazing which can join the heat sink 3 to the rear surface of the plate 1 at a low temperature. A brazing material composed of Ag, Ag and Cu, Pd, Pd and AG, etc., is used for the brazing. It is also preferable to add an active metal, such as Ti, Zr, Hf, Be, W, V, Nb, Ta, etc., to the brazing material, because the wettability of the brazing material is improved. The metal used for making the heat sink 3 includes Cu, a Cu alloy, aluminum, an aluminum alloy, stainless steel, etc.


Inventors:
KIKUCHI YOSHIHIRO
SUZUKI TAKAYUKI
HYAKKI YASUO
NAKAYAMA KENICHI
Application Number:
JP19965995A
Publication Date:
February 18, 1997
Filing Date:
August 04, 1995
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
H01J37/09; H01J37/317; H01L21/265; (IPC1-7): H01L21/265; H01J37/09; H01J37/317
Attorney, Agent or Firm:
Kunihiko Wakabayashi