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Patent Searching and Data


Title:
BENDING DEFORMATION SENSOR AND DEFORMATION MEASURING DEVICE
Document Type and Number:
Japanese Patent JP2006038710
Kind Code:
A
Abstract:

To realize a deformation measuring device capable of simply detecting a bending deformation in a flexible object, in such a state that a strain component is removed in the direction of axial force.

The deformation measuring device is equipped with a measuring section 5 and a pair of piezo-electric films which are two piezo-electric films 1a, 1b being in close contact with the surface of the object and deforming while following the bending deformation in the surface of the object. The piezo-electric films 1a, 1b are laminated such that their extension directions are identical to each other. The measuring section 5 measures a curvature change in the object, based on a difference signal of electromotive forces of respective piezo-electric films 1a, 1b caused by the bending deformation in the object.


Inventors:
Shintaku, Eiji
Fujimoto, Yukio
Tanaka, Yoshikazu
Application Number:
JP2004000220721
Publication Date:
February 09, 2006
Filing Date:
July 28, 2004
Export Citation:
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Assignee:
HIROSHIMA UNIV
International Classes:
G01B7/28; G01B7/28