BENDING DEVICE OR RESIN MOLDING - Olympus Endo Technology America Inc.

Title:

BENDING DEVICE OR RESIN MOLDING

Document Type and Number:

Japanese Patent JP3686229

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To enable a bending fabrication to be performed without marring or distorting the outer peripheral face of a resin molding.
SOLUTION: This bending device for a resin molding is equipped with an upper chuck 8 and a lower chuck 6 for retaining a part other than a part to be fabricated by bending, of a resin pipe 1. In addition, a pin 23 which can be linearly driven by an air cylinder 22 is arranged on the tip side of the resin pipe 1 retained by both chuck 8, 6. When the resin pipe 1 is bent, the pin 23 is inserted into the resin pipe 1 and is rotated by a motor 20 on the bending center of the resin pipe 1.

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Inventors:

Hirokazu Tanaka
Toru Kuboi

Application Number:

JP24682897A

Publication Date:

August 24, 2005

Filing Date:

September 11, 1997

Export Citation:

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Assignee:

Olympus Endo Technology America Inc.

International Classes:

B29C53/02; B29C53/08; B29C53/84; B29D22/00; B29D23/00; B29L22/00; B29L23/00; (IPC1-7): B29C53/08; B29C53/84; B29D23/00

Domestic Patent References:

JP5052256B2
JP6017924U
JP5131483A

Attorney, Agent or Firm:

Takeji Nara

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