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Patent Searching and Data


Title:
BENDING DEVICE
Document Type and Number:
Japanese Patent JP2008188621
Kind Code:
A
Abstract:

To provide a bending device with which the working accuracy of a preliminarily bending is improved and the quality of a product is uniformly raised in hemming work.

This device is a bending device 1 and provided with a supporting table 10, a normal bending tool holder 30, a first linkage mechanism 40 for connecting the normal bending tool holder 30 with the supporting table 10, a preliminarily bending tool holder 50, a second linkage mechanism 60 for connecting the preliminarily bending tool holder 50 with the supporting table 10 and a third linkage mechanism 70 for connecting the normal bending tool holder 30 with the preliminarily bending tool holder 40. Because the normal bending tool holder 30 is moved by being guided with the first linkage mechanism 40 and also the preliminarily bending tool holder 50 is moved by being guided with the second linkage mechanism 60, this device is constituted so as to bend a flange part by bringing the normal bending tool 31 into contact with the flange part from the upper part after bending the flange part of a workpiece by bringing the preliminarily bending tool 51 into contact with the flange part from the oblique upper part.


Inventors:
NAKATSUKA TAKESHI
AOKI HIDEO
Application Number:
JP2007024531A
Publication Date:
August 21, 2008
Filing Date:
February 02, 2007
Export Citation:
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Assignee:
UENO TECHNICA KK
International Classes:
B21D19/08; B21D39/02
Domestic Patent References:
JP2569186B21997-01-08
JP2001150038A2001-06-05
JP2006255788A2006-09-28
Attorney, Agent or Firm:
Isono Dozo
Etsuo Tada