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Title:
BENDING PROCESSING DEVICE AND BENDING PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2015123470
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a bending processing device and a processing method which apply bending processing simply and repeatedly for plural times to a workpiece while suppressing an equipment cost.SOLUTION: A bending processing device 10 comprises: first holding means 30 which holds a first end part of a workpiece 90 as movable in its longitudinal direction and swingable around an axis 30a that is vertical to a bending plane; second holding means 40 which holds a second end part of the workpiece 90 as movable in its longitudinal direction and swingable around an axis 40a that is vertical to the bending plane; a convex tool 11 which is pushed into a central position 20a between the first holding means 30 and the second holding means 40 to apply bending processing to the workpiece 90; and restriction means which restricts movement of the first holding means 30 and movement of the second holding means 40 so that the distance between the central position 20a and the first holding means 30 and the distance between the central position 20a and the second holding means 40 are equal to each other.

Inventors:
SHIMOMOTO TOSHIKI
Application Number:
JP2013269305A
Publication Date:
July 06, 2015
Filing Date:
December 26, 2013
Export Citation:
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Assignee:
NIPPON STEEL & SUMITOMO METAL CORP
International Classes:
B21D7/06
Domestic Patent References:
JPS4925830B11974-07-03
JP2013212528A2013-10-17
JPH08187520A1996-07-23
JPH10267812A1998-10-09
Foreign References:
US4827753A1989-05-09
FR1017522A1952-12-11
Attorney, Agent or Firm:
Ascend Patent Business Corporation