Title:
ベンゾオキサジン化合物、ベンゾオキサジン樹脂、ベンゾオキサジン樹脂の製造方法、硬化性樹脂組成物、その硬化物、ＦＲＰ材料、半導体封止材料、ワニス、回路基板、プリプレグ、及びビルドアップフィルム
Document Type and Number:
Japanese Patent JP6410097
Kind Code:
B2
Inventors:
Ayumu Takahashi
Yasushi Sato
Yasushi Sato
Application Number:
JP2014255076A
Publication Date:
October 24, 2018
Filing Date:
December 17, 2014
Export Citation:
Assignee:
DIC Corporation
International Classes:
C07D265/36; C08G14/073; C08J5/24; C08K3/00; C08L61/34; C09D161/34; H01L23/29; H01L23/31; H05K1/03
Domestic Patent References:
| JP5621954B2 | ||||
| JP5637419B2 | ||||
| JP41012230B1 | ||||
| JP2013249280A | ||||
| JP2000273135A | ||||
| JP11217416A | ||||
| JP2002161188A | ||||
| JP54017799B1 |
Foreign References:
| WO2014199662A1 | ||||
| WO2007097305A1 |
Attorney, Agent or Firm:
Shinji Ogawa
Akihiro Iwamoto
Takayuki Ohno
Makoto Negishi
Akihiro Iwamoto
Takayuki Ohno
Makoto Negishi