Title:
BILL STACKING DEVICE, BILL PACKAGING SYSTEM, AND BILL STACKING METHOD
Document Type and Number:
Japanese Patent JP2018116386
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a bill stacking device, a bill packaging system, and a bill stacking method, capable of detecting the quantity of bills with high accuracy.SOLUTION: A bill stacking device according to the embodiment includes a first weight measurement part, a second weight measurement part, and a control part. The first weight measurement part measures the weight of a first bill bundle in which bills are bundled and stacked in the thickness direction. The second weight measurement part measures the weight of a second bill bundle in which a first predetermined number of the first bill bundles are bundled and stacked. The control part compares the weight measured by the first weight measurement part with the weight measured by the second measurement part, and determines whether or not the number of the first bill bundles bundled as the second bill bundles is smaller than the first predetermined number.SELECTED DRAWING: Figure 2
Inventors:
NAKANISHI AYAKA
Application Number:
JP2017005707A
Publication Date:
July 26, 2018
Filing Date:
January 17, 2017
Export Citation:
Assignee:
TOSHIBA CORP
TOSHIBA INFRASTRUCTURE SYSTEMS & SOLUTIONS CORP
TOSHIBA INFRASTRUCTURE SYSTEMS & SOLUTIONS CORP
International Classes:
G07D9/00; B65B27/08
Attorney, Agent or Firm:
Shiga International Patent Office