Title:
鋳型造型用粘結剤組成物
Document Type and Number:
Japanese Patent JP7079093
Kind Code:
B2
Abstract:
The present invention is a binder composition for molding a mold, the binder composition containing a water soluble phenolic resin and a polyvinyl alcohol with an average polymerization degree of no more than 400. This invention is capable of providing the binder composition for molding a mold that can suppress the decrease of mold strength, even when a mold is molded using recycled sand as refractory particles and curing a water soluble phenolic resin with an ester-based curing agent.
Inventors:
Ryoji Iwamoto
Arakawa Kazuto
Arakawa Kazuto
Application Number:
JP2017551920A
Publication Date:
June 01, 2022
Filing Date:
November 17, 2016
Export Citation:
Assignee:
Kao Corporation
International Classes:
B22C1/22; B22C1/00; B22C1/10; B22C9/12
Foreign References:
| WO1997001604A1 |
Other References:
「現場に役立つ鋳鉄の鋳型マニュアル」、全国銑鉄鋳物工業組合連合会、平成13年1月、p.126-127ページ
Attorney, Agent or Firm:
Patent Business Corporation Unias International Patent Office
Previous Patent: Devices and methods for sample analysis
Next Patent: Composition for the treatment of infertility
Next Patent: Composition for the treatment of infertility