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Title:
BINDER COMPOSITION FOR MOLDING MOLD
Document Type and Number:
Japanese Patent JP2014024103
Kind Code:
A
Abstract:

To provide a binder composition for molding a mold, having excellent storage stability and capable of improving the productivity and final strength of the mold, and a composition for a mold using the same.

A binder composition for molding a mold includes an acid curable resin and 5-acetoxy methyl furfural, and a composition for a mold is obtained by mixing refractory particles, the binder composition for molding a mold, and a curing agent.


Inventors:
MATSUO TOSHIKI
WATANABE MASAHIKO
Application Number:
JP2012167569A
Publication Date:
February 06, 2014
Filing Date:
July 27, 2012
Export Citation:
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Assignee:
KAO CORP
International Classes:
B22C1/22; B22C1/00; B22C1/10; B22C9/02
Domestic Patent References:
JP2006070247A2006-03-16
JPH06297072A1994-10-25
Foreign References:
US20080207796A12008-08-28
Attorney, Agent or Firm:
Patent Business Corporation Unias International Patent Office



 
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