Title:
BINDER RESIN COMPOSITION FOR FRICTION MATERIAL, THERMOSETTING RESIN COMPOSITE MATERIAL CONTAINING THE SAME, AND FRICTION MATERIAL
Document Type and Number:
Japanese Patent JP2009242530
Kind Code:
A
Abstract:
To provide a binder resin composition for a friction material, which is enhanced in heat resistance and can suppress a rapid increase of the wear amount, and in addition to these properties, which has good dynamic property and enables high-temperature short-time thermoforming.
The binder resin composition for the friction material inlcudes one or two or more kinds of polybenzoxazine resins (A) selected from a condensation reaction product (a) of an aminophenol compound with formaldehydes and/or a condensation reaction product (b) of a bifunctional phenol compound and a bifunctional amine compound with formaldehydes and one or two or more kinds of particles (B) selected from inorganic particles and inorganic-organic composite particles.
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Inventors:
KURIHARA SEI
IDEI HIROSHI
AOYANAGI YOSHIHIRO
KUROE MOTONORI
IDEI HIROSHI
AOYANAGI YOSHIHIRO
KUROE MOTONORI
Application Number:
JP2008089777A
Publication Date:
October 22, 2009
Filing Date:
March 31, 2008
Export Citation:
Assignee:
AKEBONO BRAKE IND
International Classes:
C08J5/14; C08G8/16; C08G14/073; C08K3/00; C08L61/04; C08L61/34; C09K3/14
Domestic Patent References:
JP2009173807A | 2009-08-06 | |||
JP2005213301A | 2005-08-11 | |||
JPS4947378A | 1974-05-08 | |||
JP2006193538A | 2006-07-27 | |||
JP2006028246A | 2006-02-02 | |||
JPH1192623A | 1999-04-06 |
Foreign References:
WO2007097305A1 | 2007-08-30 |
Attorney, Agent or Firm:
Shizuo Nakamura