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Patent Searching and Data


Title:
BINDER
Document Type and Number:
Japanese Patent JP2012111187
Kind Code:
A
Abstract:

To provide a cutting tool or the like, which is bound with high strength by obtaining a binder with larger junction strength.

This invention relates to a binder, wherein a cemented carbide sintered compact is used as a first joined material 1 and a cBN sintered compact is used as a second joined material 2, and the first joined material and the second joined material are joined with each other, on at least two faces consisting of the back face and the bottom face of the second joined material, via a bonding material 3 which contains titanium (Ti) and is arranged therebetween. A titanium nitride (TiN) compound layer 10-300 nm thick is formed at an interface between the second joined material and the bonding material, and also the thickness of the back junction layer is smaller than the thickness of the bottom junction layer.


Inventors:
ISHIDA TOMOYUKI
MORIGUCHI HIDEKI
NAKAJIMA TAKESHI
KUKINO AKIRA
MAKI SHINICHIRO
ENAMI AKIHIRO
OKAMURA KATSUMI
MATSUDA YUSUKE
SANO KOJI
KOBAYASHI KEIZO
OZAKI KOYO
Application Number:
JP2010263778A
Publication Date:
June 14, 2012
Filing Date:
November 26, 2010
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES
SUMITOMO ELEC HARDMETAL CORP
NAT INST OF ADVANCED IND SCIEN
International Classes:
B32B15/04; B23B27/18; B23B27/20; B23K35/30; B23K35/32; C22C9/00; C22C9/06; C22C14/00; C22C16/00; C22C19/00; B23K20/00
Attorney, Agent or Firm:
Tetsuji Kamidai
Naomi Kamino