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Title:
BINDING APPARATUS FOR HORTICULTURE
Document Type and Number:
Japanese Patent JP2003341613
Kind Code:
A
Abstract:

To provide a binding apparatus for horticulture that does not leave remains of tape wastes.

The position of a tape support plate 15 supporting the tip of a tape T is disposed at a position further toward the front side than a cutter blade 10 of a driver handle. A gap in height is provided between the tape support plate 15 and a picking plate 13 with the picking plate having a lower posture. The operating timing of a picking plate drive cum mechanism is set so that the picking plate moves away from the tape support plate after the cutter blade descends to the upper edge position of the tape support plate to cut the tape. The tip portion of the tape is kept outside the cutter blade path by means of the picking plate until the tape is cut, so that the cutting of the tip portion of the tape is surely prevented irrespective of the flexibility of the tape or the temperature environment.


Inventors:
Hayashi, Susumu
Fukada, Makihito
Application Number:
JP2002000173097
Publication Date:
December 03, 2003
Filing Date:
June 13, 2002
Export Citation:
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Assignee:
MAX CO LTD
International Classes:
A01G9/12; B65B13/04; B65B13/34; B65B27/00; A01G9/12; B65B13/00; B65B13/18; B65B27/00; (IPC1-7): B65B13/04; A01G9/12; B65B13/34; B65B27/00