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Patent Searching and Data


Title:
BINDING BAND
Document Type and Number:
Japanese Patent JP2004131155
Kind Code:
A
Abstract:

To form a binding band of a comparatively inexpensive material, and also, to surely bind an article to be bound under various kinds of environments, and at the same time, to hold a sure bound state, and therefore, to reduce the cost, and to increase workability of the binding and reliability of the binding.

This binding band 1 comprises a strap part 2 and a head part 3. The strap part 2 has fastening parts 4 and 5 which are serially arranged in the longitudinal direction. The head part 3 has an insertion passage 12 through which the strap part 2 is passed, and fastening claws 17 and 18 which fasten the fastening parts 4 and 5. The binding band 1 is formed of a material of which the major components are a high density polyethylene and polypropylene. The formulation ratio for the high density polyethylene and polypropylene which are the major components can be selected in a range of 60 to 80 wt.% for the high density polyethylene and 20 to 40 wt.% for the polypropylene.


Inventors:
Kawai, Hiroichi
Application Number:
JP2002000299730
Publication Date:
April 30, 2004
Filing Date:
October 15, 2002
Export Citation:
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Assignee:
KAWAI HIROICHI
International Classes:
B65B27/00; B65D63/12; B65B27/00; B65D63/10; (IPC1-7): B65D63/12; B65B27/00