To tightly stabilize the bounded state of each item by accurately positioning the item in a specific segment of a biding area, thereby uniformizing the tension of binding band wound around the item.

The binding device comprises a conveyance path 2 for guiding each item 50 so that it can be moved, a conveying means 5 for moving the items 50 on the conveyance path 2 along the conveyance path 2, and a supply means 10 for supplying the binding band 20 to the biding area 3 of the conveying path 2 such that the band 20 crosses the conveyance path 2 and for winding the binding band 20 around the item 50 in cooperation with the item 50 on the conveyance path 2. The binding device also comprises a biding means 25, located corresponding to the binding area 3, for binding each item 50 by heat-sealing the additionally provided part of the binding band 20 wound around the item 50 and for cutting the heat-sealed part after the binding operation and separating the item 50 bounded from the binding band 20. In the binding device, a positioning means 41 for positioning the item 50 in the specific segment of the binding area 3 is disposed in the part corresponding to the binding area 3.