Title:
結束装置
Document Type and Number:
Japanese Patent JP7434850
Kind Code:
B2
Abstract:
To provide a binding apparatus capable of binding objects to be bound while suppressing an occurrence of a deformation or a scratch of the objects to be bound.SOLUTION: A binding apparatus 100 wraps a string 301 around objects to be bound 200 to bind the objects to be bound 200. When wrapping the string 301 around the objects to be bound 200, a plurality of rotatably movable protection plates 20 is disposed adjacent to each other at positions in contact with the string 301 before the objects to be bound 200.SELECTED DRAWING: Figure 1
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Inventors:
Hiroshi Ito
Miyuki Hiroba
Miyuki Hiroba
Application Number:
JP2019217532A
Publication Date:
February 21, 2024
Filing Date:
November 29, 2019
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
B65B13/22; B65B13/10; B65B27/08
Domestic Patent References:
JP2004018059A | ||||
JP8282616A |
Attorney, Agent or Firm:
Hiromi Fujimasu
Keiko Fukamachi
Hideo Ito
Naoki Goto
Hideyuki Tateishi
Keiko Fukamachi
Hideo Ito
Naoki Goto
Hideyuki Tateishi
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