Title:
BINDING MATERIAL MELTING AND FIXING DEVICE
Document Type and Number:
Japanese Patent JP2007076708
Kind Code:
A
Abstract:
To enable a large-sized band to be fed out without applying any useless heating and melting of the band when the band is fed out of a subsequent stage for bundles.
The extremity end of a head cover 31 is abutted against a bundle T, thereby the head cover 31 is retracted against a biasing force of a spring 36 to cause a heating surface 30a of the heater head 30 to be abutted against the predetermined portions of large bands K1, K2, melt and fixed. After this melting and fixing, the extremity end of the head cover 31 protruded out of the heating surface 30a of the heater head 30 is abutted against the bundle T turned by a turntable with the biasing force of a spring 36 and then the bundle T is pushed out to a subsequent stage.
Inventors:
SUZUKI SHOGO
Application Number:
JP2005268525A
Publication Date:
March 29, 2007
Filing Date:
September 15, 2005
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
B65B13/32; B65B27/08
Domestic Patent References:
| JP2003226305A | 2003-08-12 | |||
| JPH0811830A | 1996-01-16 | |||
| JPS5237091U | 1977-03-16 |
Attorney, Agent or Firm:
Takehiko Suzue
Satoshi Kono
Makoto Nakamura
Kurata Masatoshi
Takashi Mine
Yoshihiro Fukuhara
Sadao Muramatsu
Ryo Hashimoto
Satoshi Kono
Makoto Nakamura
Kurata Masatoshi
Takashi Mine
Yoshihiro Fukuhara
Sadao Muramatsu
Ryo Hashimoto