BINDING MATERIAL FOR MOLD

Title:

BINDING MATERIAL FOR MOLD

Document Type and Number:

Japanese Patent JPS5449923

Kind Code:

A

Inventors:

NAKAZAWA TETSUO
SAKAI JIYUNJI
MORIMOTO SHIYOUGO
TANIGAWA TAKATOSHI
TAKAHASHI RIYOUJI
OKAZAKI SEIJI

Application Number:

JP11559477A

Publication Date:

April 19, 1979

Filing Date:

September 28, 1977

Export Citation:

Assignee:

HITACHI LTD
HITACHI METALS LTD

International Classes:

B22C1/22; B22C1/02; B22C1/16; (IPC1-7): B22C1/02; B22C1/16

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