BINDING METHOD, AND APPARATUS THEREFOR

Japanese Patent JP3524066

B

PROBLEM TO BE SOLVED: To provide a binding method in which a work is bound by a binding band in a reliably tightened condition without any space between the work and the binding band.
SOLUTION: A band portion 2 of the binding band 1 is bent in cooperation with first and second guide members 24 and 26, and the band portion 2 is passed through a hole 7 in a head portion 3 while the head portion 3 of the binding band 1 is temporarily regulated in position by a stopper 38 held by a tension spring 39. A projecting portion from the head portion in the band portion 2 is held by a gear 43 and a band portion holding surface 46 of a guide plate 45, and pulled. In pulling the band portion 2, the stopper 38 moves the band portion along a groove 37 against the tension of the tension spring 39, the head portion 3 of the binding band 1 is moved to tighten reinforcing bars A and B. The hole 7 in the head portion 3 of the binding band 1 is directed by this binding force to the center direction which is a piercing direction of the portions to be bound of the reinforcing bars A and B, a proximal portion of the hole 7 in the head 3 in the band portion 2 is disposed along an outer surface of the reinforcing bar A to reduce a spacing between the binding band 1 and the reinforcing bar A.

Kakihashi, Takao

JP2001000027773

February 20, 2004

November 17, 1992

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AMANO CORP
RYOOICHI:KK

B65B27/00; B65B13/22; B65D63/12; B65B27/00; B65B13/18; B65D63/10; (IPC1-7): B65B27/00; B65B13/22

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