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Patent Searching and Data


Title:
BINDING METHOD USING PINCH TYPE BINDING UNIT
Document Type and Number:
Japanese Patent JP2005343538
Kind Code:
A
Abstract:

To provide a superior application to a structure for binding an object to be bound to a plate-like supporting member and supporting it through a device for the binding method using a pinch type binding unit, improve its productivity, attain an in-expensive cost and provide a superior finishing of the structure.

There is provided a binding method using a pinch type binding unit in which a binding band 7 is wound around an object (k) to be bound composed of a steel plate 31 and a wire harness 30 accompanied by this steel plate and bound under application of a pinch type automatic binding tool A having a pair of projecting pinch pieces 4, 5. A pair of oblong holes 33 corresponding to each of the pinch pieces 4, 5 are formed to allow the pair of pinch pieces 4, 5 kept under a waiting state for a releasing operation to be passed through each of the long holes 33 and then the pair of pinch pieces 4, 5 are kept under the binding action state and the binding band 7 is wound around the object (k).


Inventors:
Yokoyama, Sumihiro
Application Number:
JP2004000167197
Publication Date:
December 15, 2005
Filing Date:
June 04, 2004
Export Citation:
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Assignee:
YOKOYAMA SUMIHIRO
International Classes:
B65B27/00; H02G3/30; B65B27/00; H02G3/30; (IPC1-7): B65B27/00; H02G3/30