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Title:
BINDING TOOL
Document Type and Number:
Japanese Patent JP2007045530
Kind Code:
A
Abstract:

To bind by desired band tension even though a structure is simple and inexpensive.

The binding tool has a clamp mount (2) for a clamp for securing ends of a band and band tension devices (5, 6) provided with a band tension limiting device capable of being regulated to obtain desired band tension. An added band tension measuring device (14) is arranged between a metal fitting (2) and the band tension devices (5, 6), and the band (4) deflects laterally and establishes a relation between deflection (17) and force (15). A tool for binding the band 4 around articles is provided with the clamp mount 2 for the clamp for securing the ends of the band, the band tension devices 5, 6, and a band tension measuring device 10. The band tension measuring device 14 is provided between the clamp mount 2 and the band tension devices 5, 6, and the relation between the deflection and the force is set by deflecting the band 4 laterally.


Inventors:
Kurmis, Viktor
Application Number:
JP2006000315867
Publication Date:
February 22, 2007
Filing Date:
November 22, 2006
Export Citation:
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Assignee:
HELLERMANNTYTON GMBH
International Classes:
B65B27/00; B65B13/22; B65B27/00; B65B13/18



 
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