Title:
BIODEGRADABLE FOAMED SHEET FOR IC CARD, NON-CONTACT TYPE IC CARD AND MANUFACTURE OF THE SAME
Document Type and Number:
Japanese Patent JP3514992
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a foamed sheet capable of manufacturing IC card without damaging IC chip or the like and using a manufacturing system for polyvinyl chloride card as it is, and useful for manufacture of non-contact type IC card by including crystalline polylactic acid or the like as the principal components.
SOLUTION: This sheet includes crystalline polylactic acid or an aliphatic ester having glass transition temperature of ≤0°C, (e.g.; polybutylene succinate/ adipate copolymer or the like) as the principal components. This sheet is obtained by throwing the prescribed components or the like together with foaming agents or the like such as azodicarboxylic acid amide or the like into an extruder, melting and foaming. The non-contact type IC card is obtained by inserting a loop coil for an antenna and IC chip into the sheet or a biodegradable sheet installed with an antenna loop coil and IC chip, heating under vacuum atmosphere, pressurizing to destroy foams, and cooling under keeping the foam destroyed condition or the like.
Inventors:
Terada, Shigenori
Takagi, Jun
Takagi, Jun
Application Number:
JP35062398A
Publication Date:
April 05, 2004
Filing Date:
October 30, 1998
Export Citation:
Assignee:
MITSUBISHI PLASTICS IND LTD
International Classes:
G06K19/077; B32B5/18; B32B27/36; B42D15/10; C08J9/04; C08J9/06; C08L101/16; (IPC1-7): C08J9/04; B42D15/10; G06K19/077
Attorney, Agent or Firm:
竹内 三郎 （外１名）