Title:
バイポーラトランジスタおよびその製造方法
Document Type and Number:
Japanese Patent JP6969487
Kind Code:
B2
Abstract:
An element portion is formed on a heat dissipation substrate, and the element portion includes a collector layer, a base layer, an emitter layer, an emitter cap layer, an emitter electrode, and a base electrode. A metallic emitter heat dissipation via that connects an emitter wiring to an emitter heat dissipation pad is provided, and a metallic base heat dissipation via that connects a base wiring to a base heat dissipation pad is also provided.
Inventors:
Yuta Shiratori
Minoru Ida
Minoru Ida
Application Number:
JP2018082781A
Publication Date:
November 24, 2021
Filing Date:
April 24, 2018
Export Citation:
Assignee:
Nippon Telegraph and Telephone Corporation
International Classes:
H01L21/331; H01L29/737
Domestic Patent References:
| JP11274381A | ||||
| JP2015211049A | ||||
| JP2008181990A | ||||
| JP2019075536A |
Foreign References:
| US8860092 |
Other References:
James et al.,Experimental Method to Thermally Deembed Pads From RTH Measurements,IEEE TRANSACTIONS ON ELECTRON DEVICES,米国,IEEE,2016年09月25日,VOL.53, ISSUE 10,2540-2544,DOI:10.1109/TED.2006.882270
NOSAEVA et al.,Improved thermal management of InP transistors in transferred-substrate technology with diamond heat-spreading layer,ELECTRONICS LETTERS,\,英国,IET,2015年06月25日,VOL.51, ISSUE 13,1010-1012,DOI:10.1049/el.2015.1135
NOSAEVA et al.,Improved thermal management of InP transistors in transferred-substrate technology with diamond heat-spreading layer,ELECTRONICS LETTERS,\,英国,IET,2015年06月25日,VOL.51, ISSUE 13,1010-1012,DOI:10.1049/el.2015.1135
Attorney, Agent or Firm:
Shigeki Yamakawa
Yuzo Koike
Masaki Yamakawa
Yuzo Koike
Masaki Yamakawa