Title:
BISAMINO BENZYLPIPERAZINE DIONE, AMIDE ACID POLYMER AND POLYIMIDE, AND HOLLOW POLYIMIDE PARTICLE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP2019147743
Kind Code:
A
Abstract:
To provide polyimide which is rigid, easily powdered, and excellent in chemical resistance, heat resistance, or the like, an amide acid polymer useful as a manufacturing intermediate of the polyimide, an amide acid polymer useful as a manufacturing intermediate of the amide acid polymer, and bisamino benzylpiperazine dione useful as a manufacturing intermediate of the amide acid polymer.SOLUTION: There are provided a bisamino benzylpiperazine dione of the formula (I), an amide acid polymer using the bisamino benzylpiperazine dione as a raw material, and polyimide using the amide acid polymer as a raw material.SELECTED DRAWING: None
Inventors:
KANEKO TATSUO
TAWINDA KONGPRATET
TAWINDA KONGPRATET
Application Number:
JP2018031488A
Publication Date:
September 05, 2019
Filing Date:
February 26, 2018
Export Citation:
Assignee:
JAPAN ADVANCED INSTITUTE OF SCIENCE & TECH HOKURIKU
KANAZAWA INST OF TECHNOLOGY
KANAZAWA INST OF TECHNOLOGY
International Classes:
C07D241/08; C08G73/10; C08J3/12
Attorney, Agent or Firm:
Yoshihiro Akamatsu