Title:
黒色化表面処理銅箔及びキャリア箔付銅箔
Document Type and Number:
Japanese Patent JP6539281
Kind Code:
B2
Abstract:
Provided is a blackened surface treated copper foil having a treated surface that is blackened by fine roughening with the use of copper grains. The treated surface of the blackened surface treated copper foil has a root mean square slope RΔq of a roughness curve of 25 or less, said RΔq being measured in accordance with JIS B 0601 (2001), and a lightness index L* in L*a*b* color system of 30 or less, said L* being measured in accordance with JIS Z 8729 (2004) and JIS Z 8722 (2009). According to the present invention, a blackened surface treated copper foil, when bonded to a resin film and processed into a stripe- or mesh-type wiring for a touch panel, said blackened surface treated copper foil being capable of increasing the transparency of the film after etching the copper foil and imparting a desired black color sufficient for reducing the visibility of the stripe- or mesh-type wiring, can be provided.
Inventors:
Mizoguchi Michi
Tomonaga Sakiko
Tomonaga Sakiko
Application Number:
JP2016546563A
Publication Date:
July 03, 2019
Filing Date:
August 25, 2015
Export Citation:
Assignee:
Mitsui Mining & Smelting Co., Ltd.
International Classes:
C25D7/06; C25D1/04; C25D5/16
Domestic Patent References:
| JP20094423A | ||||
| JP2009176768A | ||||
| JP2012169598A | ||||
| JP2010226012A |
Foreign References:
| WO2013099726A1 |
Attorney, Agent or Firm:
Masaharu Takamura
Hiroki Kashima
Taku Takeishi
Hiroki Kashima
Taku Takeishi