Title:
ブレード加工装置及びブレード加工方法
Document Type and Number:
Japanese Patent JP7385985
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a blade processing device that can stably and highly accurately perform cutting process even for a work constituted of a brittle material in a ductile mode without generating a crack or breakage, and to provide a blade processing method.SOLUTION: A blade processing device includes a blade processing part 202 for dressing a tip of a blade 26 with electro-discharge machining for the blade 26 constituted of a polycrystalline diamond 26a and rotatably driven.SELECTED DRAWING: Figure 26
Inventors:
Yasuo Izumi
Hisashi Minami
Koji Watanabe
Daisuke Yanagida
Takashi Fujita
Junji Watanabe
Hisashi Minami
Koji Watanabe
Daisuke Yanagida
Takashi Fujita
Junji Watanabe
Application Number:
JP2017247994A
Publication Date:
November 24, 2023
Filing Date:
December 25, 2017
Export Citation:
Assignee:
Shin Nippon Tech Co., Ltd.
Tokyo Seimitsu Co., Ltd.
Osaka Institute of Industrial Technology
Tokyo Seimitsu Co., Ltd.
Osaka Institute of Industrial Technology
International Classes:
B24B53/00; H01L21/301
Domestic Patent References:
| JP201446530A | ||||
| JP2003127029A | ||||
| JP1121172A |
Attorney, Agent or Firm:
Kenzo Matsuura