Title:
BLADE TENSION COMPENSATING DEVICE OF SLICING MACHINE
Document Type and Number:
Japanese Patent JPH06278128
Kind Code:
A
Abstract:
PURPOSE: To slice off a wafer having good flatness and free from warpage or undulation.
CONSTITUTION: At least two fixing elements 12, 14 functioning as tension compensating means are provided on both sides holding the ingot cutting area 10 of a blade 4 therebetween so as to be opposed to the side surface of the blade 4. The tension of the blade 4 positioned in the ingot cutting area 10 is adjusted by the blade sensor 16 positioned in the cutting area to detect the tensioned state of the blade.
Inventors:
TSUCHIYAMA HIROSHI
YOSHIDA OSAMU
YOSHIDA OSAMU
Application Number:
JP6702293A
Publication Date:
October 04, 1994
Filing Date:
March 25, 1993
Export Citation:
Assignee:
NIPPON STEEL CORP
International Classes:
B24B27/06; B23D59/00; B28D5/02; H01L21/304; (IPC1-7): B28D5/02; B24B27/06; B28D1/22; H01L21/304
Attorney, Agent or Firm:
Mikio Hatta