Title:
BLADE
Document Type and Number:
Japanese Patent JP08052658
Kind Code:
A
Abstract:
PURPOSE: To provide a blade capable of performing cutting work with chipping decreased even when cut a hard brittle material.
CONSTITUTION: A superabrasive grain 20 of diamond or the like is metal-bonded by a binder 22, for instance, silver or silver alloy having thermal conductivity larger than nickel, to form a cutting edge part 16 of a blade 10. In this way, cutting heat, generated at the time of cutting a cut object, can be made to efficiently escape from the cutting edge part 16 to a base metal 12 of the blade 10. Accordingly, since accumulating the cutting heat is difficult in the cutting edge part 16, even when a hard brittle material or the like is cut, generation of chipping can be remarkably reduced.
Inventors:
Chiba, Kiyotaka
Application Number:
JP1994000188302
Publication Date:
February 27, 1996
Filing Date:
August 10, 1994
Export Citation:
Assignee:
TOKYO SEIMITSU CO LTD
International Classes:
B24D3/00; B24D3/02; B24D3/06; B24D5/12; B24D3/00; B24D3/02; B24D3/04; B24D5/00; (IPC1-7): B24D3/06; B24D3/00; B24D3/02; B24D5/12
