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Title:
ブレード、ブレードを備えたセーバソー、および、ブレードの製造方法
Document Type and Number:
Japanese Patent JP6870730
Kind Code:
B2
Abstract:
Provided is a blade capable of cutting a prescribed material to be cut in a short time while suppressing wear on a blade edge. Provided is a blade characterized in comprising a substrate that extends in a longitudinal direction and that can be mounted on a saber saw, the substrate having a back part that extends in the longitudinal direction, and a blade edge part facing the back part in relation to a facing direction that intersects the longitudinal direction, the blade edge part being provided with a curved part, and one end and another end in relation to the longitudinal direction, the curved part being provided between the one end and the other end, the curved part being curved so as to approach the back part to a greater extent than does a virtual straight line connecting the one end and the other end, and the blade having a diamond layer formed by a plurality of diamond particles bonded to the curved part.

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Inventors:
Fumizawa Hirasawa
Shin Oshima
Application Number:
JP2019502512A
Publication Date:
May 12, 2021
Filing Date:
January 26, 2018
Export Citation:
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Assignee:
Koki Holdings Co., Ltd.
International Classes:
B23D61/12; B23D49/14; B28D1/06
Domestic Patent References:
JP61236421A
JP2001179536A
JP2001252873A
JP62100823U
JP2000167774A
JP2016013581A
JP61068825U
Foreign References:
WO1999032251A1
Attorney, Agent or Firm:
Kazuhiro Kitazawa
Shin Koizumi
Fukumoto Teppei
Yoshie Kim