Title:
BLAST PROCESSING DEVICE AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2023092229
Kind Code:
A
Abstract:
To provide a blast processing device which can perform blast processing to an entire surface of an electronic component easily.SOLUTION: A blast processing device 1 includes: a component supply part 10 which supplies electronic components 100 and causes the electronic components 100 to fall continuously; a blast processing part 20 which jets a blast material 21 to surfaces of the falling electronic components 100 to perform blast processing; a component recovery separation part 30 which recovers the electronic components 100 after falling and separates the blast material 21 jetted from the blast processing part 20 from the electronic components 100; and a component transport part 40 which transports the electronic components 100 separated by the component recovery separation part 30 to the component supply part 10 again.SELECTED DRAWING: Figure 1
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Inventors:
HAMADA SHU
Application Number:
JP2021207353A
Publication Date:
July 03, 2023
Filing Date:
December 21, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO
International Classes:
B24C3/32; B22D29/00; B24C3/12; B24C5/04; B24C9/00
Attorney, Agent or Firm:
Patent Attorney Firm WisePlus