Title:
ブリスターパッキングマシン内のブリスターパック切断装置
Document Type and Number:
Japanese Patent JP4928680
Kind Code:
B2
Abstract:
A device (D) for cutting single blister packs (41) from a blister band (40) includes cutting means (11) acting in a longitudinal direction with respect to the blister band (40), along the longitudinal edges thereof, so as to cut side extending strips (42) of said blister band (40) which extend beyond the length of the blister pack (41) being produced; cut out means (12) operate in alignment with the cutting line of the cutting means (11) to cut shaped pieces of the blister band (40), so as to define corner zones of the blister packs (41); shearing means (13) operate crosswise to the blister band (40), in alignment with the corner zones defined by the cut out means (12), to separate single blister packs (41). The position of the cutting means (11) and cut out means (12) and/or the shearing means (13) can be adjusted to produce blister packs (41) having different sizes.
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Inventors:
Betty claudio
Application Number:
JP2001138715A
Publication Date:
May 09, 2012
Filing Date:
May 09, 2001
Export Citation:
Assignee:
I. A. A. Industria McKine Automatique Societa Pell Atchioni
International Classes:
B26D3/00; B65B61/06; B26D1/08; B26D1/24; B26D7/26; B26F1/38; B65B59/00
Domestic Patent References:
| JP52121489A | ||||
| JP3005525U |
Foreign References:
| GB2184086A |
Attorney, Agent or Firm:
▲吉▼川 俊雄